MANUFACTURING TECHNOLOGY OF PASSIVE ELEMENTS OF OPTOELECTRONIC MICROWAVE BOARDS WITH AIR BRIDGES
Section: AMPL-SCHOOL (SESSION Y)
Authors:
1.
Institut optiki atmosfery SO RAN
2.
V.E. Zuev Institute of Atmospheric Optics SB RAS
Tomsk, Tomsk, Russian Federation
Tomsk, Tomsk, Russian Federation
3.
Institut optiki atmosfery im. V.E. Zueva SO RAN
Type:
Сonference article
Pages:
from 148
to 150
Published:
13.09.2025
Subject area:
VAK Russia 1.3.6
UDC 621.396
CSCSTI 29.31
Russian Classification of Professions by Education 03.04.02
Russian Library and Bibliographic Classification 223
Russian Trade and Bibliographic Classification 6135
BISAC TEC019000 Lasers & Photonics
UDC 621.396
CSCSTI 29.31
Russian Classification of Professions by Education 03.04.02
Russian Library and Bibliographic Classification 223
Russian Trade and Bibliographic Classification 6135
BISAC TEC019000 Lasers & Photonics
Language:
Russian
Keywords:
hybrid integrated circuits, optoelectronic boards, air bridge connections, radar systems
Funding:
The work was carried out within the framework of IAO SB RAS state assignment.
Abstract (English):
In the standard technology of optoelectronic boards, discrete silicon or ceramic capacitors are widely used in signal filtering and separation circuits, the use of which is accompanied by the need to install wire jumpers by welding methods, which leads to a mismatch with the wave impedance of microstrip lines due to a violation of the planarity of the structure and partial reflection of the microwave signal. In order to eliminate these shortcomings, the laboratory of radiophotonics of the IAO SB RAS proposed a technology for manufacturing the passive part of optoelectronic boards with thin-film capacitors and air bridge connections manufactured using planar technology on a single substrate in one technological cycle using standard highly efficient methods of magnetron sputtering and galvanic deposition.
In the standard technology of optoelectronic boards, discrete silicon or ceramic capacitors are widely used in signal filtering and separation circuits, the use of which is accompanied by the need to install wire jumpers by welding methods, which leads to a mismatch with the wave impedance of microstrip lines due to a violation of the planarity of the structure and partial reflection of the microwave signal. In order to eliminate these shortcomings, the laboratory of radiophotonics of the IAO SB RAS proposed a technology for manufacturing the passive part of optoelectronic boards with thin-film capacitors and air bridge connections manufactured using planar technology on a single substrate in one technological cycle using standard highly efficient methods of magnetron sputtering and galvanic deposition.
Keywords:
hybrid integrated circuits, optoelectronic boards, air bridge connections, radar systems
hybrid integrated circuits, optoelectronic boards, air bridge connections, radar systems
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