Tomsk, Tomsk, Russian Federation
This research evaluates the advantages of using metal‑filled via technology in microstrip boards (MSBs), which significantly boosts the reliability of high‑frequency applications by minimizing parasitic capacitance — a key requirement for microwave systems. The study compares the performance of three configurations: MSBs with filled vias, uniform single‑layer microstrip lines, and MSBs with thin‑film‑metallized through‑holes. Evaluated characteristics include structural strength, parasitic capacitance, and thermal conductivity. Results show that the metal‑filled approach offers superior thermal stability and reduced parasitic capacitance. These improvements are critical for microwave devices where long‑term stability and operational reliability are essential.
Metal-filled through-holes, electrochemical deposition, Joule heating, microstrip boards, parasitic capacitance
1. Wang, Y. Research Progress on Key Technologies of Microelectronics for Industry 4.0 // Academic Journal of Science and Technology. 2022. Vol. 2.(3). P.4-6.
2. Petrova, S. A. Peredovye tendencii v mikroelektronike: ot novyh materialov do kvantovyh vychisleniy // Molodoy uchenyy. 2024. № 3 (502). S. 29–30.
3. Krasnikov, G. Ya. Tendencii razvitiya mikroelektronnyh tehnologiy // Nanoindustriya. 2019. №14 (9). S. 101-107.
4. Kumbz K.F. Pechatnye platy: spravochnik: v 2 knigah // perevod s angliyskogo pod redakciey A. M. Medvedeva. Moskva:Tehnosfera, 2007. Kn. 1. 504 s. ; Kn. 2. 480 s. ISBN 978-5-94836-111-2.
5. Rui Ling Yew, Brett C. Johnson, Brant C. Gibson, Abdulghani M. A review of airborne Doppler lidar for wind-sensing // Progress in Aerospace Sciences. 2025, Vol. 157, 101127
6. Udalov A.A., Baboshko D.V., Shesterikov E.V. Tehnologiya zaraschivaniya metallom skvoznyh otverstiy v keramicheskih mikropoloskovyh platah s pomosch'yu elektrohimicheskogo osazhdeniya // Papers of the 17th International Conference AMPL‑2025. AMPL‑SCHOOL (Session Y). Tomsk, PAPERS OF THE 17TH INTERNATIONAL CONFERENCE AMPL-2025, 2025. S. 178–181.
7. Zayavka na patent № RU2806812. Sposob izgotovleniya mikropoloskovyh plat SVCh-diapazona s perehodnymi metallizirovannymi otverstiyami na osnove mikrovolnovyh dielektricheskih podlozhek: № 2023101563: zayavl. 25.01.2023 : opubl. 07.11.2023 / M.K. Suchkov ; zayavitel', patentobladatel' Akcionernoe obschestvo "Nauchno-issledovatel'skiy institut mikroelektronnoy apparatury "Progress" (AO "NIIMA "Progress") // FIPS : [sayt]. – URL: https://patents.google.com/patent/RU2806812C1/ru (data obrascheniya: 06.06.2025)
8. Patent CN101137768. Copper surface treatment method and copper: № 101137768; pub.2011.09.21 / Tomoaki Yamashita, Yasuo Inoue, Masaharu Matsuu, Toyoki Ito, Akira Shimizu, Fumio Inoue, Akashi Nakazu: - URL: https://patents.google.com/patent/CN101137768B/en?q=(vias+chemical+coppering)&oq=vias+chemical+coppering
9. Brett Tingley. Private Japanese moon lander crashed due to laser errors, ispace says [Elektronnyy resurs]. URL: https://www.space.com/space-exploration/launches-spacecraft/private-japanese-moon-lander-crashed-due-to-laser-errors-ispace-says (data obrascheniya 03.04.2025).
10. Rui Ling Yew, Brett C. Johnson, Brant C. Gibson, Abdulghani M. A review of airborne Doppler lidar for wind-sensing // Progress in Aerospace Sciences. 2025, Vol. 157, 101127
