TY  CONF
TI  Through-holes vias ceramic microstrip board metal filling by electrochemical deposition
KW  electrochemical deposition
KW  integral scheme
KW  metal filled through-hole vias
KW  microstrip boards
KW  photoresist mask.
JO  XVII International conference on pulsed lasers and laser applications – AMPL-2025
AU  Udalov, A.A.
AU  Baboshko, D.V.
AU  Shesterikov, E.V.
PY  2025
PB  V.E. Zuev Institute of Atmospheric Optics, Siberian Branch of the Russian Academy of Sciences