%0 Conference Article
%T Through-holes vias ceramic microstrip board metal filling by electrochemical deposition
%A Udalov, A.A.
%A Baboshko, D.V.
%A Shesterikov, E.V.
%K electrochemical deposition, integral scheme, metal filled through-hole vias, microstrip boards, photoresist mask.
%J XVII International conference on pulsed lasers and laser applications – AMPL-2025
%D 2025
%P 3
%I V.E. Zuev Institute of Atmospheric Optics, Siberian Branch of the Russian Academy of Sciences