@article{Udalov2025through-holes,
author={Udalov, A.A. and Baboshko, D.V. and Shesterikov, E.V.},
title={Through-holes vias ceramic microstrip board metal filling by electrochemical deposition},
conference={XVII International conference on pulsed lasers and laser applications – AMPL-2025},
publisher={V.E. Zuev Institute of Atmospheric Optics, Siberian Branch of the Russian Academy of Sciences},
year={2025},
pages={182-185},
}